•Responsible for driving the activities of package design, tooling, material selection, reliability qualification and development of related assembly processes to achieve cost effective package with superior reliability.

Work with  Customer and Product line in development new Products within committed quality, reliability, time and cost.

 

Requirements:

•Master’s/Bachelor Degree in Electrical/Electronic/Mechanical Engineering, Physics, Material Science or equivalent.

•Min 3 years of experience in MLP/QFN package development and assembly process development in semiconductor industry.

•Experience in semiconductor packaging assembly processes is preferred.

•A self-starter with good interpersonal skills and able to work under minimum supervision.