<?xml version="1.0"?><WEBSERVICE version="1.0">
				<ENV>
					<REQUEST_TIME>2012-2-23 12:54:24</REQUEST_TIME>
					<CID>4</CID>
					<SCID>11</SCID>
					<URL><![CDATA[/details/10964698.html]]></URL>
				</ENV>
				<GENERAL>
					<NAME>monster.com.my</NAME>
				</GENERAL><DATA>
  <APPLY_URL></APPLY_URL>
  <CAT><![CDATA[Manufacturing/ Engineering/ R&D]]></CAT>
  <CHANNEL_ID>4</CHANNEL_ID>
  <CLOSE>2012-03-26</CLOSE>
  <COMPANY>94839</COMPANY>
  <COMPANY_NAME><![CDATA[Intel Corporation]]></COMPANY_NAME>
  <COMP_PROFILE><![CDATA[Employees in Intel&#x27;s Mobility Group design and implement the Intel® Mobile Technology used in notebook computers, phones, ultra-mobile PCs and other portable devices. Intel&#x27;s industry leading technology includes processors, chipsets, Enhanced Data for GSM Environment (EDGE), Universal Mobile Telecommunications System (UMTS), High-Speed Downlink Packet Access (HSDPA), Wi-Fi and WiMAX wireless radios. These industry-leading technologies are driving the new mobile era of semiconductors, where people will carry their computing with them, making it truly personal. This group is growing very quickly and has the broadest set of mobile and wireless technologies in the industry.]]></COMP_PROFILE>
  <COMP_PROFILE_URL></COMP_PROFILE_URL>
  <COORDINATOR_EMAIL>tale.selvi.muniandi@intel.com</COORDINATOR_EMAIL>
  <COORDINATOR_NAME><![CDATA[Muniandi, Tale Selvi]]></COORDINATOR_NAME>
  <COORDINATOR_PHONE>(604) 253 8960</COORDINATOR_PHONE>
  <CURRENCY_ID></CURRENCY_ID>
  <DESCR><![CDATA[In this position, you will be providing physical failure analysis support for all failure analysis businesses in all aspects of local manufacturing (product quals, yield, down-binning, experiments, Final QA and right down to FACR) and other virtual factories activities (Fab sort yield improvement and division FA). Your responsibilities will include but not be limited to:    Transmission Electron Microscopy (TEM) Operating for failure analysis  Focus Ion Beam (FIB) operating for failure analysis  EDX analysis for failure analysis.  Requirements You must possess the below minimum qualifications to be consider for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience can be obtained through a combination of prior education, current MS/Ph.D. course work, projects, research and any relevant prior job/internships. Minimum Qualifications:    This is an entry level position for a recent college graduate with a Master of Science or Ph.D. degree in Materials Science, Electrical Engineering, Chemistry, or Physics.   Minimum 1 year experience with microelectronic device characterization or imaging or chemical analysis using equipment such as acoustic or x-ray imaging, TEM/STEM/SEM/Focused Ion Beam (FIB) systems, or EDX/EELS techniques.  Good knowledge in the front end processing, device physics, advanced MOSFET devices and process integration. Preferred Qualifications:    Graduating with a Ph.D. is preferred   Knowledge of thin film process deposition and characterization, semiconductor device physics, interconnect reliability, reliability statistics is an added advantage   Ability to deal with ambiguity   Knowledge of various material interactions and interfacial reactions during processing, testing and stressing would be an added advantage, to enable correlation of physical mechanisms to electrical performance   Ability to work effectively within cross site and/or cultural environment with strong communication skills, self-discipline would be an added advantage ]]></DESCR>
  <EXTRA_INFO>:VP=0:SQ=:DURATION=60:REGULAR=:SERVICE_DURATION=365:PARAMETERS=DURATION:CP=0:BOLD=1:BL=0:URL_CONTROL=0:SRLOGO=4:JDLOGO=4:IS_IT=1:ROLE_FLAG=1:G_HINTS=Engineering jobs:</EXTRA_INFO>
  <FOLDERID>10964698</FOLDERID>
  <FREE_TEXT_COLS></FREE_TEXT_COLS>
  <HIDE_CNAME>0</HIDE_CNAME>
  <INDUSTRY><![CDATA[Electronics Manufacturing, Semiconductor Manufacturing]]></INDUSTRY>
  <JD_LOGO>1</JD_LOGO>
  <JOB_FROM>SEA_MOHQ</JOB_FROM>
  <JOB_TYPE>fulltime</JOB_TYPE>
  <KEYSKILLS><![CDATA[experience with microelectronic device characterization or imaging or chemical analysis using equipment such as acoustic or x-ray imaging, TEM/STEM/SEM/Focused Ion Beam (FIB) systems, or EDX/EELS techniques.]]></KEYSKILLS>
  <LEVEL></LEVEL>
  <LOC>,296,</LOC>
  <MAXEXP>2</MAXEXP>
  <MAXSAL></MAXSAL>
  <MAXSAL_CHANNEL>0</MAXSAL_CHANNEL>
  <MINEXP>1</MINEXP>
  <MINSAL></MINSAL>
  <MINSAL_CHANNEL>0</MINSAL_CHANNEL>
  <NATIONALITY>,,</NATIONALITY>
  <POSTINGDATE>2012-01-26 15:12:59</POSTINGDATE>
  <REF_CODE><![CDATA[]]></REF_CODE>
  <RELINDEX>1</RELINDEX>
  <ROLES>,17,:,569,584,608,</ROLES>
  <STREAM><![CDATA[]]></STREAM>
  <SUMMARY><![CDATA[We are inviting suitable candidate to apply for the role - Failure Analysis Engineer (Graduate Trainee)]]></SUMMARY>
  <TITLE><![CDATA[Failure Analysis Engineer (Graduate Trainee)]]></TITLE>
  <TRANSFORM_LOC><![CDATA[Penang]]></TRANSFORM_LOC>
  <TRANSFORM_ROLE><![CDATA[Management Trainee, Process Engineer, Quality Assurance/ Control]]></TRANSFORM_ROLE>
  <UPDATEDATE>0</UPDATEDATE>
  <XCODE>xintelmyx</XCODE>
</DATA>
</WEBSERVICE>
